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Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin

Metal surfaces can be polished effectively and in an environmentally friendly way by virtue of the mechanical and electrochemical interaction between ion-exchange resin particles and the metal substrate. This paper studied this ‘dry’ polishing process and its property effects on 65 brass alloys. Sur...

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Detalles Bibliográficos
Autores principales: Min, Rui, Wang, Lishi, Cheng, Yihang, Hu, Xinbin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9043278/
https://www.ncbi.nlm.nih.gov/pubmed/35492769
http://dx.doi.org/10.1039/d1ra07219f
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author Min, Rui
Wang, Lishi
Cheng, Yihang
Hu, Xinbin
author_facet Min, Rui
Wang, Lishi
Cheng, Yihang
Hu, Xinbin
author_sort Min, Rui
collection PubMed
description Metal surfaces can be polished effectively and in an environmentally friendly way by virtue of the mechanical and electrochemical interaction between ion-exchange resin particles and the metal substrate. This paper studied this ‘dry’ polishing process and its property effects on 65 brass alloys. Surface morphology analysis revealed that the surface roughness can be reduced by over 71.5% from 0.764 ± 0.031 μm to 0.218 ± 0.080 μm with longer polishing time, and by over 67.1% from 0.764 ± 0.031 μm to 0.252 ± 0.02 μm with higher voltage. XPS and EDS results showed that only a small amount of oxygen species remained on the polished metal surface, while Cu and Zn were apparently present in the metallic state. The decrease in self-corrosion current indicated by the Tafel curves and the increase in the radius of the capacitive reactance circle contained in the Nyquist plots indicate that the surface corrosion resistance of the polished materials has been improved.
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spelling pubmed-90432782022-04-28 Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin Min, Rui Wang, Lishi Cheng, Yihang Hu, Xinbin RSC Adv Chemistry Metal surfaces can be polished effectively and in an environmentally friendly way by virtue of the mechanical and electrochemical interaction between ion-exchange resin particles and the metal substrate. This paper studied this ‘dry’ polishing process and its property effects on 65 brass alloys. Surface morphology analysis revealed that the surface roughness can be reduced by over 71.5% from 0.764 ± 0.031 μm to 0.218 ± 0.080 μm with longer polishing time, and by over 67.1% from 0.764 ± 0.031 μm to 0.252 ± 0.02 μm with higher voltage. XPS and EDS results showed that only a small amount of oxygen species remained on the polished metal surface, while Cu and Zn were apparently present in the metallic state. The decrease in self-corrosion current indicated by the Tafel curves and the increase in the radius of the capacitive reactance circle contained in the Nyquist plots indicate that the surface corrosion resistance of the polished materials has been improved. The Royal Society of Chemistry 2021-11-05 /pmc/articles/PMC9043278/ /pubmed/35492769 http://dx.doi.org/10.1039/d1ra07219f Text en This journal is © The Royal Society of Chemistry https://creativecommons.org/licenses/by/3.0/
spellingShingle Chemistry
Min, Rui
Wang, Lishi
Cheng, Yihang
Hu, Xinbin
Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title_full Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title_fullStr Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title_full_unstemmed Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title_short Dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
title_sort dry electrochemical polishing of copper alloy in a medium containing ion-exchange resin
topic Chemistry
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9043278/
https://www.ncbi.nlm.nih.gov/pubmed/35492769
http://dx.doi.org/10.1039/d1ra07219f
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