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Enhanced thermal conductivity of nanocomposites with MOF-derived encapsulated magnetic oriented carbon nanotube-grafted graphene polyhedra
It remains a challenge to develop highly polymer-based nanocomposite thermal interface materials, which can effectively remove heat developed during the miniaturization of electronic instruments. It has been reported that a large number of graphene-based nanocomposites exhibit excellent performance....
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
The Royal Society of Chemistry
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9048813/ https://www.ncbi.nlm.nih.gov/pubmed/35497737 http://dx.doi.org/10.1039/c9ra09199h |
Sumario: | It remains a challenge to develop highly polymer-based nanocomposite thermal interface materials, which can effectively remove heat developed during the miniaturization of electronic instruments. It has been reported that a large number of graphene-based nanocomposites exhibit excellent performance. However, it is still an issue to construct thermal conductive pathways by orientation arrangements with a low filler volume fraction. Herein, a high-thermal conductivity filler of magnetic carbon nanotube-grafted graphene polyhedra (Co@Co(3)O(4)-G) was exploited via the annealing of metal–organic frameworks (ZIF-67). Co@Co(3)O(4)-G can improve the thermal conductivity of nanocomposites obviously by forming oriented pathways for phonon transport in an external magnetic field. Therefore, the resulting nanocomposite displayed a high thermal conductivity of 2.11 W m(−1) K(−1) for only 8.7 vol%, which is 10 times higher than that of the pure epoxy resin. Core-shell magnetic cobalt oxide (Co@Co(3)O(4)) was encapsulated in situ in the nanoarchitecture to avoid falling off. Moreover, the equilibrium molecular dynamics (EMD) simulation verifies that Co@Co(3)O(4)-G had high thermal conductivity to effectively improve the heat dissipation of nanocomposites. This strategy provides an approach for developing high-performance thermal management materials and opens up the possibility for the pioneering applications of encapsulated magnetic-oriented thermal conductive fillers. |
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