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Flexible and low-k polymer featuring hard–soft-hybrid strategy

One of the main challenges for dielectric materials for advanced microelectronics is their high dielectric value and brittleness. In this study, we adopted a hard–soft-hybrid strategy and successfully introduced a hard, soft segment and covalent crosslinked structural unit into a hybridized skeleton...

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Detalles Bibliográficos
Autores principales: Hu, Huan, Ma, Jiajun, Yuan, Wen, Peng, Qiuxia, Yang, Junxiao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9050597/
https://www.ncbi.nlm.nih.gov/pubmed/35496624
http://dx.doi.org/10.1039/d0ra01122c

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