Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

Within this work, we demonstrate that an easy soldering process in combination with wet chemical coating is suitable to realize a strong and reliable solder interconnection of Al substrates, even at short soldering times <5 s in ambient air. The microstructure of solder joints on wet chemically t...

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Detalles Bibliográficos
Autores principales: De Rose, Angela, Mikolasch, Gabriele, Kamp, Mathias, Kraft, Achim, Nowottnick, Mathias
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2020
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9057496/
https://www.ncbi.nlm.nih.gov/pubmed/35520830
http://dx.doi.org/10.1039/d0ra06115h

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9057496/
https://www.ncbi.nlm.nih.gov/pubmed/35520830
http://dx.doi.org/10.1039/d0ra06115h

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