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Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times
Within this work, we demonstrate that an easy soldering process in combination with wet chemical coating is suitable to realize a strong and reliable solder interconnection of Al substrates, even at short soldering times <5 s in ambient air. The microstructure of solder joints on wet chemically t...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9057496/ https://www.ncbi.nlm.nih.gov/pubmed/35520830 http://dx.doi.org/10.1039/d0ra06115h |