Solvent-free electrically conductive Ag/ethylene vinyl acetate (EVA) composites for paper-based printable electronics

Solvent-free electrically conductive composites have been applied to flexible electronics to obtain high electrical conductivity. However, some of the proposed composites have low electrical conductivities and are unable to meet the requirements of commercial printable electronics. In this study, solvent-free electrically conductive Ag/EVA (ethylene vinyl acetate) composites for paper-based printable electronics were prepared by a thermal melting method. The properties of these electrically conductive Ag/EVA composites, including particle sizes, morphologies and phase purities of the flake silver flake powders, were investigated using a particle size analyzer, scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. The results showed that nanometer-thick flake silver flake powders with smooth and flat surfaces were made by the nanofilm transition technique. These obtained powders were able to form smooth face-to-face contacts, which facilitated the formation of an excellent conductive network in the conductive system. Dynamic mechanical analysis (DMA) was conducted to investigate the mechanical properties of EVA and Ag/EVA composites. A Fourier transformation infra-red (FTIR) spectrometer, laser micro-Raman spectrometer and thermogravimetric analyzer were used to analyze the organic functional groups, glass transition temperatures and thermal weight losses of the EVA resin and solvent-free electrically conductive composites. The solvent-free electrically conductive Ag/EVA composite, which contained 55 wt% of the as-prepared flake silver flake powders, was found to have an extremely low volume resistivity of 1.23 × 10(−4) Ω cm as well as excellent bending performance and adhesion. These features indicate the great potential of these composites for application in printed electronics.