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Extremely flat metal films implemented by surface roughness transfer for flexible electronics
We present an innovative approach to fabricate an extremely flat (EF) metal film which was done by depositing metal on an extremely flat mother substrate, then detaching the metal from the substrate. The detached flexible metal films had a roughness that was within 2% of the roughness of the mother...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
The Royal Society of Chemistry
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9078984/ https://www.ncbi.nlm.nih.gov/pubmed/35541518 http://dx.doi.org/10.1039/c8ra00298c |
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author | Kim, Kisoo Kim, Sungjoo Jung, Gwan Ho Lee, Ilhwan Kim, Sungjun Ham, Juyoung Dong, Wan Jae Hong, Kihyon Lee, Jong-Lam |
author_facet | Kim, Kisoo Kim, Sungjoo Jung, Gwan Ho Lee, Ilhwan Kim, Sungjun Ham, Juyoung Dong, Wan Jae Hong, Kihyon Lee, Jong-Lam |
author_sort | Kim, Kisoo |
collection | PubMed |
description | We present an innovative approach to fabricate an extremely flat (EF) metal film which was done by depositing metal on an extremely flat mother substrate, then detaching the metal from the substrate. The detached flexible metal films had a roughness that was within 2% of the roughness of the mother substrate, so EFs with R(a) < 1 nm could be fabricated using the surface roughness transfer method. With quantitative analysis using in situ synchrotron XPS, it was concluded that the chemical reaction of oxygen atoms with the metal film played a critical role in designing a peel-off system to get extremely flat metal films from the mother substrate. The OLED was successfully implemented on the metal film. The OLED's luminance could be increased from 15 142 to 17 100 cd m(−2) at 25 mA m(−2) by replacing the glass substrate with an EF copper (Cu) substrate, due to the enhanced heat dissipation during the operation. This novel method can be very useful for mass production of large scale, low-cost and high quality metal films using roll-to-roll process. |
format | Online Article Text |
id | pubmed-9078984 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | The Royal Society of Chemistry |
record_format | MEDLINE/PubMed |
spelling | pubmed-90789842022-05-09 Extremely flat metal films implemented by surface roughness transfer for flexible electronics Kim, Kisoo Kim, Sungjoo Jung, Gwan Ho Lee, Ilhwan Kim, Sungjun Ham, Juyoung Dong, Wan Jae Hong, Kihyon Lee, Jong-Lam RSC Adv Chemistry We present an innovative approach to fabricate an extremely flat (EF) metal film which was done by depositing metal on an extremely flat mother substrate, then detaching the metal from the substrate. The detached flexible metal films had a roughness that was within 2% of the roughness of the mother substrate, so EFs with R(a) < 1 nm could be fabricated using the surface roughness transfer method. With quantitative analysis using in situ synchrotron XPS, it was concluded that the chemical reaction of oxygen atoms with the metal film played a critical role in designing a peel-off system to get extremely flat metal films from the mother substrate. The OLED was successfully implemented on the metal film. The OLED's luminance could be increased from 15 142 to 17 100 cd m(−2) at 25 mA m(−2) by replacing the glass substrate with an EF copper (Cu) substrate, due to the enhanced heat dissipation during the operation. This novel method can be very useful for mass production of large scale, low-cost and high quality metal films using roll-to-roll process. The Royal Society of Chemistry 2018-03-19 /pmc/articles/PMC9078984/ /pubmed/35541518 http://dx.doi.org/10.1039/c8ra00298c Text en This journal is © The Royal Society of Chemistry https://creativecommons.org/licenses/by/3.0/ |
spellingShingle | Chemistry Kim, Kisoo Kim, Sungjoo Jung, Gwan Ho Lee, Ilhwan Kim, Sungjun Ham, Juyoung Dong, Wan Jae Hong, Kihyon Lee, Jong-Lam Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title | Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title_full | Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title_fullStr | Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title_full_unstemmed | Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title_short | Extremely flat metal films implemented by surface roughness transfer for flexible electronics |
title_sort | extremely flat metal films implemented by surface roughness transfer for flexible electronics |
topic | Chemistry |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9078984/ https://www.ncbi.nlm.nih.gov/pubmed/35541518 http://dx.doi.org/10.1039/c8ra00298c |
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