Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials

Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl...

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Autores principales: Moore, Levi M. J., Zavala, Jacob J., Lamb, Jason T., Reams, Josiah T., Yandek, Gregory R., Guenthner, Andrew J., Haddad, Timothy S., Ghiassi, Kamran B.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2018
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9083338/
https://www.ncbi.nlm.nih.gov/pubmed/35539971
http://dx.doi.org/10.1039/c8ra05954c
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author Moore, Levi M. J.
Zavala, Jacob J.
Lamb, Jason T.
Reams, Josiah T.
Yandek, Gregory R.
Guenthner, Andrew J.
Haddad, Timothy S.
Ghiassi, Kamran B.
author_facet Moore, Levi M. J.
Zavala, Jacob J.
Lamb, Jason T.
Reams, Josiah T.
Yandek, Gregory R.
Guenthner, Andrew J.
Haddad, Timothy S.
Ghiassi, Kamran B.
author_sort Moore, Levi M. J.
collection PubMed
description Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl-functional dichlorosilane onto tetrasilanol phenyl POSS, yielding two geometric isomers.
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spelling pubmed-90833382022-05-09 Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials Moore, Levi M. J. Zavala, Jacob J. Lamb, Jason T. Reams, Josiah T. Yandek, Gregory R. Guenthner, Andrew J. Haddad, Timothy S. Ghiassi, Kamran B. RSC Adv Chemistry Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl-functional dichlorosilane onto tetrasilanol phenyl POSS, yielding two geometric isomers. The Royal Society of Chemistry 2018-07-31 /pmc/articles/PMC9083338/ /pubmed/35539971 http://dx.doi.org/10.1039/c8ra05954c Text en This journal is © The Royal Society of Chemistry https://creativecommons.org/licenses/by/3.0/
spellingShingle Chemistry
Moore, Levi M. J.
Zavala, Jacob J.
Lamb, Jason T.
Reams, Josiah T.
Yandek, Gregory R.
Guenthner, Andrew J.
Haddad, Timothy S.
Ghiassi, Kamran B.
Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title_full Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title_fullStr Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title_full_unstemmed Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title_short Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
title_sort bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
topic Chemistry
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9083338/
https://www.ncbi.nlm.nih.gov/pubmed/35539971
http://dx.doi.org/10.1039/c8ra05954c
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