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In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging
[Image: see text] High-performance, high-reliability microelectronic devices are essential for many applications. Thermal management is required to ensure that the temperature of semiconductor devices remains in a safe operating range. Advanced materials, such as silver-sintered die attach (the bond...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9097469/ https://www.ncbi.nlm.nih.gov/pubmed/35573030 http://dx.doi.org/10.1021/acsaelm.1c01239 |