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Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
Autor principal: | |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143019/ https://www.ncbi.nlm.nih.gov/pubmed/35630216 http://dx.doi.org/10.3390/mi13050749 |
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author | Seok, Seonho |
author_facet | Seok, Seonho |
author_sort | Seok, Seonho |
collection | PubMed |
description | |
format | Online Article Text |
id | pubmed-9143019 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-91430192022-05-29 Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” Seok, Seonho Micromachines (Basel) Editorial MDPI 2022-05-09 /pmc/articles/PMC9143019/ /pubmed/35630216 http://dx.doi.org/10.3390/mi13050749 Text en © 2022 by the author. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Editorial Seok, Seonho Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title | Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title_full | Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title_fullStr | Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title_full_unstemmed | Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title_short | Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” |
title_sort | editorial for the special issue “mems packaging technologies and 3d integration” |
topic | Editorial |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143019/ https://www.ncbi.nlm.nih.gov/pubmed/35630216 http://dx.doi.org/10.3390/mi13050749 |
work_keys_str_mv | AT seokseonho editorialforthespecialissuememspackagingtechnologiesand3dintegration |