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Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”

Detalles Bibliográficos
Autor principal: Seok, Seonho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143019/
https://www.ncbi.nlm.nih.gov/pubmed/35630216
http://dx.doi.org/10.3390/mi13050749
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author Seok, Seonho
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spelling pubmed-91430192022-05-29 Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration” Seok, Seonho Micromachines (Basel) Editorial MDPI 2022-05-09 /pmc/articles/PMC9143019/ /pubmed/35630216 http://dx.doi.org/10.3390/mi13050749 Text en © 2022 by the author. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Editorial
Seok, Seonho
Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title_full Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title_fullStr Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title_full_unstemmed Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title_short Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
title_sort editorial for the special issue “mems packaging technologies and 3d integration”
topic Editorial
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143019/
https://www.ncbi.nlm.nih.gov/pubmed/35630216
http://dx.doi.org/10.3390/mi13050749
work_keys_str_mv AT seokseonho editorialforthespecialissuememspackagingtechnologiesand3dintegration