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Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors

This paper reports a MEMS capacitive pressure sensor (CPS) based on the operating principle of touch mode. The CPS was designed and fabricated using wafer-level self-packaged MEMS processes. The variable capacitance sensing structure was vacuum-sealed in a cavity using the Si–glass anodic bonding te...

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Detalles Bibliográficos
Autores principales:	Wan, Yuanjie, Li, Zhiwei, Huang, Zile, Hu, Baofa, Lv, Wenlong, Zhang, Chunquan, San, Haisheng, Zhang, Shaoda
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9144918/ https://www.ncbi.nlm.nih.gov/pubmed/35630205 http://dx.doi.org/10.3390/mi13050738

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