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Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution

This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from th...

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Detalles Bibliográficos
Autores principales: Park, Sung-Sik, Park, Jun-Woo, Yoon, Keun-Byoung, Park, Il Seouk, Woo, Seung-Wook, Lee, Dong-Eun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9147147/
https://www.ncbi.nlm.nih.gov/pubmed/35631846
http://dx.doi.org/10.3390/polym14101964
Descripción
Sumario:This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from the laboratory test, simulation analysis that uses a heat transfer fluid model of a ground-coupled heat pump (GCHP) system confirms the EM-APAS-lime binder performs best in the compressive strength and thermal conductivity; EM-APAS mixture performs best in the durability. However, the slake durability index of specimens containing EM-APAS-lime is equal to or greater than 80%. In addition, the compressive strength of sand stabilized with the EM-APAS-lime mixture is more than three times that of sand stabilized with cement. The thermal conductivity of sand stabilized with cement and that of sand treated with EM-APAS-lime mixture are 0.1 W/m·K and 0.9–1 W/m·K, respectively. It is confirmed that the heat collection of sand stabilized with EM-APAS-lime outperforms five times over that of sand stabilized with cement. These findings provide admissible evidence that the EM-APAS-lime mixture, which outperforms cement in compressive strength and thermal conductivity, is most suitable for ground improvement binder for GCHP systems.