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Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution

This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from th...

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Autores principales: Park, Sung-Sik, Park, Jun-Woo, Yoon, Keun-Byoung, Park, Il Seouk, Woo, Seung-Wook, Lee, Dong-Eun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9147147/
https://www.ncbi.nlm.nih.gov/pubmed/35631846
http://dx.doi.org/10.3390/polym14101964
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author Park, Sung-Sik
Park, Jun-Woo
Yoon, Keun-Byoung
Park, Il Seouk
Woo, Seung-Wook
Lee, Dong-Eun
author_facet Park, Sung-Sik
Park, Jun-Woo
Yoon, Keun-Byoung
Park, Il Seouk
Woo, Seung-Wook
Lee, Dong-Eun
author_sort Park, Sung-Sik
collection PubMed
description This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from the laboratory test, simulation analysis that uses a heat transfer fluid model of a ground-coupled heat pump (GCHP) system confirms the EM-APAS-lime binder performs best in the compressive strength and thermal conductivity; EM-APAS mixture performs best in the durability. However, the slake durability index of specimens containing EM-APAS-lime is equal to or greater than 80%. In addition, the compressive strength of sand stabilized with the EM-APAS-lime mixture is more than three times that of sand stabilized with cement. The thermal conductivity of sand stabilized with cement and that of sand treated with EM-APAS-lime mixture are 0.1 W/m·K and 0.9–1 W/m·K, respectively. It is confirmed that the heat collection of sand stabilized with EM-APAS-lime outperforms five times over that of sand stabilized with cement. These findings provide admissible evidence that the EM-APAS-lime mixture, which outperforms cement in compressive strength and thermal conductivity, is most suitable for ground improvement binder for GCHP systems.
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spelling pubmed-91471472022-05-29 Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution Park, Sung-Sik Park, Jun-Woo Yoon, Keun-Byoung Park, Il Seouk Woo, Seung-Wook Lee, Dong-Eun Polymers (Basel) Article This paper presents findings obtained by evaluating the compressive strength, thermal conductivity, and durability of sand cylinder specimens stabilized with either epoxy emulsion (EM), acrylic polymer aqueous solution (APAS), EM-APAS mixture, or EM-APAS-lime mixture. Given the data obtained from the laboratory test, simulation analysis that uses a heat transfer fluid model of a ground-coupled heat pump (GCHP) system confirms the EM-APAS-lime binder performs best in the compressive strength and thermal conductivity; EM-APAS mixture performs best in the durability. However, the slake durability index of specimens containing EM-APAS-lime is equal to or greater than 80%. In addition, the compressive strength of sand stabilized with the EM-APAS-lime mixture is more than three times that of sand stabilized with cement. The thermal conductivity of sand stabilized with cement and that of sand treated with EM-APAS-lime mixture are 0.1 W/m·K and 0.9–1 W/m·K, respectively. It is confirmed that the heat collection of sand stabilized with EM-APAS-lime outperforms five times over that of sand stabilized with cement. These findings provide admissible evidence that the EM-APAS-lime mixture, which outperforms cement in compressive strength and thermal conductivity, is most suitable for ground improvement binder for GCHP systems. MDPI 2022-05-11 /pmc/articles/PMC9147147/ /pubmed/35631846 http://dx.doi.org/10.3390/polym14101964 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Park, Sung-Sik
Park, Jun-Woo
Yoon, Keun-Byoung
Park, Il Seouk
Woo, Seung-Wook
Lee, Dong-Eun
Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title_full Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title_fullStr Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title_full_unstemmed Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title_short Evaluation of Compressive Strength and Thermal Conductivity of Sand Stabilized with Epoxy Emulsion and Polymer Solution
title_sort evaluation of compressive strength and thermal conductivity of sand stabilized with epoxy emulsion and polymer solution
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9147147/
https://www.ncbi.nlm.nih.gov/pubmed/35631846
http://dx.doi.org/10.3390/polym14101964
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