Cargando…

Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer

[Image: see text] Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In...

Descripción completa

Detalles Bibliográficos
Autores principales: Park, Junghyun, Kim, Donghyun, Kim, Hyunsik, Park, Woon Ik, Lee, Junghoon, Chung, Wonsub
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2022
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9178951/
https://www.ncbi.nlm.nih.gov/pubmed/35694474
http://dx.doi.org/10.1021/acsomega.2c02522
_version_ 1784723165427007488
author Park, Junghyun
Kim, Donghyun
Kim, Hyunsik
Park, Woon Ik
Lee, Junghoon
Chung, Wonsub
author_facet Park, Junghyun
Kim, Donghyun
Kim, Hyunsik
Park, Woon Ik
Lee, Junghoon
Chung, Wonsub
author_sort Park, Junghyun
collection PubMed
description [Image: see text] Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications.
format Online
Article
Text
id pubmed-9178951
institution National Center for Biotechnology Information
language English
publishDate 2022
publisher American Chemical Society
record_format MEDLINE/PubMed
spelling pubmed-91789512022-06-10 Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer Park, Junghyun Kim, Donghyun Kim, Hyunsik Park, Woon Ik Lee, Junghoon Chung, Wonsub ACS Omega [Image: see text] Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications. American Chemical Society 2022-05-27 /pmc/articles/PMC9178951/ /pubmed/35694474 http://dx.doi.org/10.1021/acsomega.2c02522 Text en © 2022 The Authors. Published by American Chemical Society https://creativecommons.org/licenses/by-nc-nd/4.0/Permits non-commercial access and re-use, provided that author attribution and integrity are maintained; but does not permit creation of adaptations or other derivative works (https://creativecommons.org/licenses/by-nc-nd/4.0/).
spellingShingle Park, Junghyun
Kim, Donghyun
Kim, Hyunsik
Park, Woon Ik
Lee, Junghoon
Chung, Wonsub
Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title_full Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title_fullStr Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title_full_unstemmed Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title_short Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer
title_sort superhydrophobic electrodeposited copper surface for robust condensation heat transfer
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9178951/
https://www.ncbi.nlm.nih.gov/pubmed/35694474
http://dx.doi.org/10.1021/acsomega.2c02522
work_keys_str_mv AT parkjunghyun superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer
AT kimdonghyun superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer
AT kimhyunsik superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer
AT parkwoonik superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer
AT leejunghoon superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer
AT chungwonsub superhydrophobicelectrodepositedcoppersurfaceforrobustcondensationheattransfer