Cargando…
Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses
In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The...
Autores principales: | , , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9181855/ https://www.ncbi.nlm.nih.gov/pubmed/35683198 http://dx.doi.org/10.3390/ma15113902 |
_version_ | 1784723887564521472 |
---|---|
author | Kremer, Robert Khani, Somayeh Appel, Tamara Palkowski, Heinz Foadian, Farzad |
author_facet | Kremer, Robert Khani, Somayeh Appel, Tamara Palkowski, Heinz Foadian, Farzad |
author_sort | Kremer, Robert |
collection | PubMed |
description | In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The manufactured parts were also used to validate the developed model. Subsequently, a sequentially coupled thermal–mechanical FEM model was developed using the Ansys software package. The developed model was able to deliver the mechanical properties, residual stresses, and microstructure of the additively manufactured components. Due to introducing some simplifications to the model, a calibration factor was applied to adjust the simulation results. However, the developed model was validated and showed a good agreement with the experimental results, such as measured residual stresses using the hole drilling method, as well as mechanical properties of manufactured parts. Moreover, the developed material model was used to simulate the microstructure of manufactured CuSn10. A fine-grain microstructure with an average diameter of 19 ± 11 μm and preferred orientation in the Z-direction, which was the assembly direction, was obtained. |
format | Online Article Text |
id | pubmed-9181855 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-91818552022-06-10 Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses Kremer, Robert Khani, Somayeh Appel, Tamara Palkowski, Heinz Foadian, Farzad Materials (Basel) Article In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The manufactured parts were also used to validate the developed model. Subsequently, a sequentially coupled thermal–mechanical FEM model was developed using the Ansys software package. The developed model was able to deliver the mechanical properties, residual stresses, and microstructure of the additively manufactured components. Due to introducing some simplifications to the model, a calibration factor was applied to adjust the simulation results. However, the developed model was validated and showed a good agreement with the experimental results, such as measured residual stresses using the hole drilling method, as well as mechanical properties of manufactured parts. Moreover, the developed material model was used to simulate the microstructure of manufactured CuSn10. A fine-grain microstructure with an average diameter of 19 ± 11 μm and preferred orientation in the Z-direction, which was the assembly direction, was obtained. MDPI 2022-05-30 /pmc/articles/PMC9181855/ /pubmed/35683198 http://dx.doi.org/10.3390/ma15113902 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Kremer, Robert Khani, Somayeh Appel, Tamara Palkowski, Heinz Foadian, Farzad Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title | Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title_full | Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title_fullStr | Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title_full_unstemmed | Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title_short | Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses |
title_sort | selective laser melting of cusn10: simulation of mechanical properties, microstructure, and residual stresses |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9181855/ https://www.ncbi.nlm.nih.gov/pubmed/35683198 http://dx.doi.org/10.3390/ma15113902 |
work_keys_str_mv | AT kremerrobert selectivelasermeltingofcusn10simulationofmechanicalpropertiesmicrostructureandresidualstresses AT khanisomayeh selectivelasermeltingofcusn10simulationofmechanicalpropertiesmicrostructureandresidualstresses AT appeltamara selectivelasermeltingofcusn10simulationofmechanicalpropertiesmicrostructureandresidualstresses AT palkowskiheinz selectivelasermeltingofcusn10simulationofmechanicalpropertiesmicrostructureandresidualstresses AT foadianfarzad selectivelasermeltingofcusn10simulationofmechanicalpropertiesmicrostructureandresidualstresses |