Investigation on the Basic Characteristics of Semi-Fixed Abrasive Grains Polishing Technique for Polishing Sapphire (α-Al(2)O(3))

Single-crystal sapphire (α-Al(2)O(3)) is an important material and widely used in many advanced fields. The semi-fixed abrasive grain processing method based on solid-phase reaction theory is a prominent processing method for achieving ultra-precision damage-free surfaces. In order to develop the proposed method for polishing sapphire, the basic characteristics of the semi-fixed abrasive grains polishing tool for polishing sapphire were determined. Weight analysis was used to study the influence rules of parameters on surface roughness and material removal rates using an orthogonal experiment. Then, the optimized polishing tool was obtained through a mixture of abrasive particle sizes to reduce the difficulty in molding the polishing tool. Finally, polishing experiments using different polishing tools were carried out to investigate polishing performance by considering the surface roughness, material removal rate and the surface morphology during polishing. The results showed that (1) external load affects the surface roughness and material removal rate the most, followed by abrasive particle size, sand bond ratio, revolution speed of the workpiece and he polishing tool; (2) the difficulty in manufacturing the polishing tool could be reduced by mixing larger abrasive particles with small abrasive particles; (3) the polishing tool with 200 nm and 1 μm particle sizes performed best in the first 210 min polishing.