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Nanohollow Titanium Oxide Structures on Ti/FTO Glass Formed by Step-Bias Anodic Oxidation for Photoelectrochemical Enhancement

In this study, a new anodic oxidation with a step-bias increment is proposed to evaluate oxidized titanium (Ti) nanostructures on transparent fluorine-doped tin oxide (FTO) on glass. The optimal Ti thickness was determined to be 130 nm. Compared to the use of a conventional constant bias of 25 V, a...

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Detalles Bibliográficos
Autores principales: Huang, Chi-Hsien, Lu, Yu-Jen, Pan, Yong-Chen, Liu, Hui-Ling, Chang, Jia-Yuan, Sie, Jhao-Liang, Pijanowska, Dorota G., Yang, Chia-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182085/
https://www.ncbi.nlm.nih.gov/pubmed/35683780
http://dx.doi.org/10.3390/nano12111925
Descripción
Sumario:In this study, a new anodic oxidation with a step-bias increment is proposed to evaluate oxidized titanium (Ti) nanostructures on transparent fluorine-doped tin oxide (FTO) on glass. The optimal Ti thickness was determined to be 130 nm. Compared to the use of a conventional constant bias of 25 V, a bias ranging from 5 V to 20 V with a step size of 5 V for 3 min per period can be used to prepare a titanium oxide (TiO(x)) layer with nanohollows that shows a large increase in current of 142% under UV illumination provided by a 365 nm LED at a power of 83 mW. Based on AFM and SEM, the TiO(x) grains formed in the step-bias anodic oxidation were found to lead to nanohollow generation. Results obtained from EDS mapping, HR-TEM and XPS all verified the TiO(x) composition and supported nanohollow formation. The nanohollows formed in a thin TiO(x) layer can lead to a high surface roughness and photon absorbance for photocurrent generation. With this step-bias anodic oxidation methodology, TiO(x) with nanohollows can be obtained easily without any extra cost for realizing a high current under photoelectrochemical measurements that shows potential for electrochemical-based sensing applications.