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Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials
We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fl...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182425/ https://www.ncbi.nlm.nih.gov/pubmed/35683227 http://dx.doi.org/10.3390/ma15113932 |
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author | Franz, Daniel Häfner, Tom Kunz, Tim Roth, Gian-Luca Rung, Stefan Esen, Cemal Hellmann, Ralf |
author_facet | Franz, Daniel Häfner, Tom Kunz, Tim Roth, Gian-Luca Rung, Stefan Esen, Cemal Hellmann, Ralf |
author_sort | Franz, Daniel |
collection | PubMed |
description | We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fluences up to 11.5 J/cm [Formula: see text] are applied to optimize the quality of microvias, as being evaluated by the generated taper, the extension of glass fiber protrusions and damage of inner lying copper layers using materialography. The results are discussed in terms of the ablation threshold for FR-4 and copper, heat accumulation and pulse shielding effects as a result of pulse to pulse interactions. As a specific result, using a laser pulse duration of 2 ps appears beneficial, resulting in small glass fiber protrusions and high precision in the stopping process at inner copper layer. If laser pulse repetition rates larger than 100 kHz are applied, we find that the processing quality can be increased by heat accumulation effects. |
format | Online Article Text |
id | pubmed-9182425 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-91824252022-06-10 Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials Franz, Daniel Häfner, Tom Kunz, Tim Roth, Gian-Luca Rung, Stefan Esen, Cemal Hellmann, Ralf Materials (Basel) Article We report on a comprehensive study of laser percussion microvia drilling of FR-4 printed circuit board material using ultrashort pulse lasers with emission in the green spectral region. Laser pulse durations in the pico- and femtosecond regime, laser pulse repetition rates up to 400 kHz and laser fluences up to 11.5 J/cm [Formula: see text] are applied to optimize the quality of microvias, as being evaluated by the generated taper, the extension of glass fiber protrusions and damage of inner lying copper layers using materialography. The results are discussed in terms of the ablation threshold for FR-4 and copper, heat accumulation and pulse shielding effects as a result of pulse to pulse interactions. As a specific result, using a laser pulse duration of 2 ps appears beneficial, resulting in small glass fiber protrusions and high precision in the stopping process at inner copper layer. If laser pulse repetition rates larger than 100 kHz are applied, we find that the processing quality can be increased by heat accumulation effects. MDPI 2022-05-31 /pmc/articles/PMC9182425/ /pubmed/35683227 http://dx.doi.org/10.3390/ma15113932 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Franz, Daniel Häfner, Tom Kunz, Tim Roth, Gian-Luca Rung, Stefan Esen, Cemal Hellmann, Ralf Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title | Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title_full | Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title_fullStr | Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title_full_unstemmed | Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title_short | Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials |
title_sort | ultrashort pulsed laser drilling of printed circuit board materials |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182425/ https://www.ncbi.nlm.nih.gov/pubmed/35683227 http://dx.doi.org/10.3390/ma15113932 |
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