Grain Size Effects on Mechanical Properties of Nanocrystalline Cu(6)Sn(5) Investigated Using Molecular Dynamics Simulation

Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of electronics. Cu(6)Sn(5) is one of the main components of IMCs, and its mechanical properties considerably influence the reliability of solder joints. In this study, the effects of grain size (8–20 nm) on the mechanical...

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Detalles Bibliográficos
Autores principales: Huang, Wei, Pan, Kailin, Wang, Bo, Gong, Yubing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182516/
https://www.ncbi.nlm.nih.gov/pubmed/35683187
http://dx.doi.org/10.3390/ma15113889

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182516/
https://www.ncbi.nlm.nih.gov/pubmed/35683187
http://dx.doi.org/10.3390/ma15113889

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