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Grain Size Effects on Mechanical Properties of Nanocrystalline Cu(6)Sn(5) Investigated Using Molecular Dynamics Simulation
Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of electronics. Cu(6)Sn(5) is one of the main components of IMCs, and its mechanical properties considerably influence the reliability of solder joints. In this study, the effects of grain size (8–20 nm) on the mechanical...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182516/ https://www.ncbi.nlm.nih.gov/pubmed/35683187 http://dx.doi.org/10.3390/ma15113889 |