Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates

The rapid development of the 5G communication technology requires the improvement of the thermal stability and dielectric performance of high-frequency copper clad laminates (CCL). A cyclic olefin copolymer (COC) resin was added to the original 1,2-polybutadienes (PB)/styrene ethylene butylene styre...

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Detalles Bibliográficos
Autores principales: Dong, Jiaojiao, Wang, Hao, Zhang, Qilong, Yang, Hui, Cheng, Jianlin, Xia, Zhaoyue
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182675/
https://www.ncbi.nlm.nih.gov/pubmed/35683874
http://dx.doi.org/10.3390/polym14112200

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182675/
https://www.ncbi.nlm.nih.gov/pubmed/35683874
http://dx.doi.org/10.3390/polym14112200

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