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Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conv...

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Autores principales: Feng, Chang-Ping, Wei, Fang, Sun, Kai-Yin, Wang, Yan, Lan, Hong-Bo, Shang, Hong-Jing, Ding, Fa-Zhu, Bai, Lu, Yang, Jie, Yang, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Nature Singapore 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9198190/
https://www.ncbi.nlm.nih.gov/pubmed/35699776
http://dx.doi.org/10.1007/s40820-022-00868-8
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author Feng, Chang-Ping
Wei, Fang
Sun, Kai-Yin
Wang, Yan
Lan, Hong-Bo
Shang, Hong-Jing
Ding, Fa-Zhu
Bai, Lu
Yang, Jie
Yang, Wei
author_facet Feng, Chang-Ping
Wei, Fang
Sun, Kai-Yin
Wang, Yan
Lan, Hong-Bo
Shang, Hong-Jing
Ding, Fa-Zhu
Bai, Lu
Yang, Jie
Yang, Wei
author_sort Feng, Chang-Ping
collection PubMed
description Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed. [Image: see text]
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spelling pubmed-91981902022-06-16 Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application Feng, Chang-Ping Wei, Fang Sun, Kai-Yin Wang, Yan Lan, Hong-Bo Shang, Hong-Jing Ding, Fa-Zhu Bai, Lu Yang, Jie Yang, Wei Nanomicro Lett Review Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed. [Image: see text] Springer Nature Singapore 2022-06-14 /pmc/articles/PMC9198190/ /pubmed/35699776 http://dx.doi.org/10.1007/s40820-022-00868-8 Text en © The Author(s) 2022 https://creativecommons.org/licenses/by/4.0/Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Review
Feng, Chang-Ping
Wei, Fang
Sun, Kai-Yin
Wang, Yan
Lan, Hong-Bo
Shang, Hong-Jing
Ding, Fa-Zhu
Bai, Lu
Yang, Jie
Yang, Wei
Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title_full Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title_fullStr Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title_full_unstemmed Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title_short Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application
title_sort emerging flexible thermally conductive films: mechanism, fabrication, application
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9198190/
https://www.ncbi.nlm.nih.gov/pubmed/35699776
http://dx.doi.org/10.1007/s40820-022-00868-8
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