Cargando…

Impact of Coronavirus Disease 2019 (COVID-19) on Healthcare-Associated Infections in Arizona Acute Care Hospitals: 2016-2020 HAI Progress Report

BACKGROUND: Since March 2020, coronavirus disease 2019 (COVID-19) has impacted clinical practices among Arizona acute care hospitals (ACHs), potentially affecting healthcare-associated infection (HAI) rates among these facilities. The Arizona Department of Health Services (ADHS) analyzed the impact...

Descripción completa

Detalles Bibliográficos
Autores principales:	Golenko, Catherine, Kim, Elizabeth, Bhattarai, Rachana, Chorbi, Kaitlyn, Naderi, Mandana, Borlaug, Gwen, Komatsu, Kenneth K.
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Published by Mosby, Inc. 2022
Materias:	Its-61
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9215335/ http://dx.doi.org/10.1016/j.ajic.2022.03.108

Ejemplares similares

Multifacility outbreak of Candida auris during the COVID-19 pandemic—Maricopa County, Arizona, April 2022–December 2022
por: Prasai, Siru, et al.
Publicado: (2023)

Analyse d’une épidémie à SARS-CoV-2 en EHPAD : quels enseignements ?
por: Lesens, O., et al.
Publicado: (2020)

Treatment of infra-bony periodontal defects using a collagen membrane and a bone substitute of equine origin – a pilot study
por: Izidoro, C., et al.
Publicado: (2021)

Retentissement de la pandémie de COVID-19 sur la prise en charge oncologique des patients : résultats de l’étude COVIPACT
por: Lequesne, J., et al.
Publicado: (2021)

THE VALUE OF SHEAR-WAVE ELASTOGRAPHY IN THE DIAGNOSIS AND FOLLOW-UP OF POST COVID-19 SUBACUTE THYROIDITIS
por: Golu, Ioana, et al.
Publicado: (2022)

Full-scale model of the ALICE ITS Detector
Publicado: (2004)

ALICE ITS
Publicado: (2003)

ALICE Pixel Ladder (5 chips bump bonded to 1 sensor) mounted on prototype bus
Publicado: (2002)

ALICE pixel prototype bus with 10 readout chips
Publicado: (2002)

ALICE pixel readout chip with 8192 readout channels
Publicado: (2001)

ALICE ITS Testbeam setup with 4 pixel reference planes
Publicado: (2002)

ALICE ITS
Publicado: (2003)

ALICE Carbon fibre sector support
Publicado: (2001)

ALICE ladder mounted on prototype bus
Publicado: (2002)

ALICE ladder mounted and wire bonded on prototype bus
Publicado: (2002)

ALICE Testbeam 2002-Reference plane made of 2 bump bonded single chip assemblies
Publicado: (2002)

SEM picture of bump bonding pads on ALICE readout chip
Publicado: (2002)

Probing of ALICE single chip assembly
Publicado: (2001)

Multiple trigger scintillators were installed: big ones covering the total surface of the sensor and several smaller ones. The former give a trigger for each beam particle. The latter are used to select a part of the sensor surface for efficiency measurements.
por: Nooren, G.
Publicado: (2004)

In ALICE particles will hit the sensors at oblique angles. This is partly simulated here by rotating the modules.
por: Nooren, G.
Publicado: (2004)

Installation of the light tight cover for the SSD modules (the modules are behind the aluminium plate). The silicon sensors are sensitive to light tight, so ambient light will increase the noise and may even damage them.
por: Nooren, G.
Publicado: (2004)

The T10 beam produces a few hits per event. In ALICE the SSD will have to cope with many hits per strip. In the three centimeters of aluminium the beam will produce many secondary particles. This increases the chance of multiple hits per strip, although not to the level in ALICE.
por: Nooren, G.
Publicado: (2004)

A silicon Drift Detector and its two fronted boards
por: Nouais, D.
Publicado: (2004)

Particular of the set up for testing the cooling system of SDD
por: Alessandro, B.
Publicado: (2004)

Set up to test the cooling system of SDD
por: Alessandro, B.
Publicado: (2004)

The board with the front-end ASIC's called PASCAL and AMBRA (part of readout setup)
por: Alessandro, B.
Publicado: (2004)

The DAQ screen during the test of the readout of SDD
por: Alessandro, B.
Publicado: (2004)

Set up to test the redout chain of SDD
por: Alessandro, B.
Publicado: (2004)

The board with the compression ASIC called CARLOS (part of readout setup)
por: Alessandro, B.
Publicado: (2004)

Front-end chip cable and jif on Delvotec (bonding machine)
por: Alessandro, B.
Publicado: (2004)

Hybrid bonding on K&S manual bonder
por: Alessandro, B.
Publicado: (2004)

Completed hybrid
por: Alessandro, B.
Publicado: (2004)

Chip cables aligned on hybrid on assembly jig
por: Alessandro, B.
Publicado: (2004)

The read-out electronics boards contain ASICs (ALABUF and ALCAPONE) to condition and buffer the analog signals and to control the front-end chips (HAL25).
por: Nooren, G.
Publicado: (2004)

Working of the 1st supermodule of the the PHOS photon spectrometer which contains 3584 lead tungstate crystals. One crystal is 18 centimetre long and weighs some 750 grams. Photo: Antonio Saba. Photographer. www.antoniosaba.com
por: Saba, Antonio
Publicado: (2006)

Members of the ALICE Pixel team testing the second sector of the ALICE Silicon Pixel Detector in the divisional silicon facility laboratory at CERN
por: Saba, A
Publicado: (2006)

View of the control room at the CERN Divisional Silicon Facilty
por: Saba, A
Publicado: (2006)

In the photograph, one can see the interconnection from one readout chip to the flexible cable realized with ultrasonic wire bonds (25 microns).
por: Saba, A
Publicado: (2006)

Working of the 1st supermodule of the the PHOS photon spectrometer which contasins 3584 lead tungstate crystals. One crystal is 18 centimetre long and weighs some 750 grams.
por: Saba, A
Publicado: (2006)

Wire bonding of the MCM multi chip module using 25 micron wire at CERN.
por: Saba, A
Publicado: (2006)

Cannot write session to /tmp/vufind_sessions/sess_eo12vrgh1benutgb5alihe42jr