Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM

To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and s...

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Detalles Bibliográficos
Autores principales: Zhang, Wenchao, Chang, Hao, Liu, Yu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228367/
https://www.ncbi.nlm.nih.gov/pubmed/35744585
http://dx.doi.org/10.3390/mi13060972
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author Zhang, Wenchao
Chang, Hao
Liu, Yu
author_facet Zhang, Wenchao
Chang, Hao
Liu, Yu
author_sort Zhang, Wenchao
collection PubMed
description To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and solid-state material transformation, and residual stress. The crack initiated by the thermal stress in the recast layer was investigated, and a mathematical model of crack tip stress was proposed. The results showed a wide range of residual stresses from 44 MPa to 404 MPa. The model is validated using experimental data with three points on the surface layer.
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spelling pubmed-92283672022-06-25 Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM Zhang, Wenchao Chang, Hao Liu, Yu Micromachines (Basel) Article To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and solid-state material transformation, and residual stress. The crack initiated by the thermal stress in the recast layer was investigated, and a mathematical model of crack tip stress was proposed. The results showed a wide range of residual stresses from 44 MPa to 404 MPa. The model is validated using experimental data with three points on the surface layer. MDPI 2022-06-19 /pmc/articles/PMC9228367/ /pubmed/35744585 http://dx.doi.org/10.3390/mi13060972 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zhang, Wenchao
Chang, Hao
Liu, Yu
Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title_full Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title_fullStr Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title_full_unstemmed Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title_short Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM
title_sort study on solidification process and residual stress of sicp/al composites in edm
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228367/
https://www.ncbi.nlm.nih.gov/pubmed/35744585
http://dx.doi.org/10.3390/mi13060972
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AT changhao studyonsolidificationprocessandresidualstressofsicpalcompositesinedm
AT liuyu studyonsolidificationprocessandresidualstressofsicpalcompositesinedm

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