Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the ext...

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Detalles Bibliográficos
Autores principales: Liu, Jun, Xia, Shanhong, Peng, Chunrong, Wu, Zhengwei, Chu, Zhaozhi, Zhang, Zhouwei, Lei, Hucheng, Zheng, Fengjie, Zhang, Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229140/
https://www.ncbi.nlm.nih.gov/pubmed/35744542
http://dx.doi.org/10.3390/mi13060928

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229140/
https://www.ncbi.nlm.nih.gov/pubmed/35744542
http://dx.doi.org/10.3390/mi13060928

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