A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is le...

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Autores principales: Sun, Lingyao, Guo, Zhenhua, Zhao, Xiuchen, Liu, Ying, Tu, Kingning, Liu, Yingxia
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229535/
https://www.ncbi.nlm.nih.gov/pubmed/35744481
http://dx.doi.org/10.3390/mi13060867
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author Sun, Lingyao
Guo, Zhenhua
Zhao, Xiuchen
Liu, Ying
Tu, Kingning
Liu, Yingxia
author_facet Sun, Lingyao
Guo, Zhenhua
Zhao, Xiuchen
Liu, Ying
Tu, Kingning
Liu, Yingxia
author_sort Sun, Lingyao
collection PubMed
description We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.
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spelling pubmed-92295352022-06-25 A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly Sun, Lingyao Guo, Zhenhua Zhao, Xiuchen Liu, Ying Tu, Kingning Liu, Yingxia Micromachines (Basel) Article We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder. MDPI 2022-05-31 /pmc/articles/PMC9229535/ /pubmed/35744481 http://dx.doi.org/10.3390/mi13060867 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Sun, Lingyao
Guo, Zhenhua
Zhao, Xiuchen
Liu, Ying
Tu, Kingning
Liu, Yingxia
A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title_full A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title_fullStr A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title_full_unstemmed A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title_short A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
title_sort new low-temperature solder assembly technique to replace eutectic sn-bi solder assembly
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229535/
https://www.ncbi.nlm.nih.gov/pubmed/35744481
http://dx.doi.org/10.3390/mi13060867
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