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Numerical Study to Enhance the Sensitivity of a Surface Plasmon Resonance Sensor with BlueP/WS(2)-Covered Al(2)O(3)-Nickel Nanofilms

In the traditional surface plasmon resonance sensor, the sensitivity is calculated by the usage of angular interrogation. The proposed surface plasmon resonance (SPR) sensor uses a diamagnetic material (Al(2)O(3)), nickel (Ni), and two-dimensional (2D) BlueP/WS(2) (blue phosphorous-tungsten di-sulfi...

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Detalles Bibliográficos
Autores principales: Shivangani, Alotaibi, Maged F., Al-Hadeethi, Yas, Lohia, Pooja, Singh, Sachin, Dwivedi, D. K., Umar, Ahmad, Alzayed, Hamdah M., Algadi, Hassan, Baskoutas, Sotirios
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9268592/
https://www.ncbi.nlm.nih.gov/pubmed/35808043
http://dx.doi.org/10.3390/nano12132205
Descripción
Sumario:In the traditional surface plasmon resonance sensor, the sensitivity is calculated by the usage of angular interrogation. The proposed surface plasmon resonance (SPR) sensor uses a diamagnetic material (Al(2)O(3)), nickel (Ni), and two-dimensional (2D) BlueP/WS(2) (blue phosphorous-tungsten di-sulfide). The Al(2)O(3) sheet is sandwiched between silver (Ag) and nickel (Ni) films in the Kretschmann configuration. A mathematical simulation is performed to improve the sensitivity of an SPR sensor in the visible region at a frequency of 633 nm. The simulation results show that an upgraded sensitivity of 332°/RIU is achieved for the metallic arrangement consisting of 17 nm of Al(2)O(3) and 4 nm of Ni in thickness for analyte refractive indices ranging from 1.330 to 1.335. The thickness variation of the layers plays a curial role in enhancing the performance of the SPR sensor. The thickness variation of the proposed configuration containing 20 nm of Al(2)O(3) and 1 nm of Ni with a monolayer of 2D material BlueP/WS(2) enhances the sensitivity to as high as 374°/RIU. Furthermore, it is found that the sensitivity can be altered and managed by means of altering the film portions of Ni and Al(2)O(3)