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Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging

When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhe...

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Autores principales: Garbowski, Tomasz, Gajewski, Tomasz, Knitter-Piątkowska, Anna
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9268991/
https://www.ncbi.nlm.nih.gov/pubmed/35808303
http://dx.doi.org/10.3390/s22134800
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author Garbowski, Tomasz
Gajewski, Tomasz
Knitter-Piątkowska, Anna
author_facet Garbowski, Tomasz
Gajewski, Tomasz
Knitter-Piątkowska, Anna
author_sort Garbowski, Tomasz
collection PubMed
description When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhelmingly analog. Recently, new innovative technologies have emerged that have begun to replace or at least supplement old techniques. This paper presents the results of laboratory tests on corrugated board and packaging made using both analog and digital technologies. Cardboard samples with digital and analog creases are subject to various mechanical tests, which allows for an assessment of the impact of creases on the mechanical properties of the cardboard itself, as well as on the behavior of the packaging. It is proven that digital technology is not only more repeatable, but also weakens the structure of corrugated board to a much lesser extent than analog. An updated numerical model of boxes in compression tests is also discussed. The effect of the crushing of the material in the vicinity of the crease lines in the packaging arising during the analog and digital finishing processes is taken into account. The obtained enhanced computer simulation results closely reflect the experimental observations, which prove that the correct numerical analysis of corrugated cardboard packaging should be performed with the model taking into account the crushing.
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spelling pubmed-92689912022-07-09 Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging Garbowski, Tomasz Gajewski, Tomasz Knitter-Piątkowska, Anna Sensors (Basel) Article When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhelmingly analog. Recently, new innovative technologies have emerged that have begun to replace or at least supplement old techniques. This paper presents the results of laboratory tests on corrugated board and packaging made using both analog and digital technologies. Cardboard samples with digital and analog creases are subject to various mechanical tests, which allows for an assessment of the impact of creases on the mechanical properties of the cardboard itself, as well as on the behavior of the packaging. It is proven that digital technology is not only more repeatable, but also weakens the structure of corrugated board to a much lesser extent than analog. An updated numerical model of boxes in compression tests is also discussed. The effect of the crushing of the material in the vicinity of the crease lines in the packaging arising during the analog and digital finishing processes is taken into account. The obtained enhanced computer simulation results closely reflect the experimental observations, which prove that the correct numerical analysis of corrugated cardboard packaging should be performed with the model taking into account the crushing. MDPI 2022-06-25 /pmc/articles/PMC9268991/ /pubmed/35808303 http://dx.doi.org/10.3390/s22134800 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Garbowski, Tomasz
Gajewski, Tomasz
Knitter-Piątkowska, Anna
Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title_full Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title_fullStr Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title_full_unstemmed Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title_short Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
title_sort influence of analog and digital crease lines on mechanical parameters of corrugated board and packaging
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9268991/
https://www.ncbi.nlm.nih.gov/pubmed/35808303
http://dx.doi.org/10.3390/s22134800
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