Investigating Machine Learning Techniques for Predicting the Process Characteristics of Stencil Printing

Stencil printing is the most crucial process in reflow soldering for the mass assembly of electronic circuits. This paper investigates different machine learning-based methods to predict the essential process characteristics of stencil printing: the area, thickness, and volume of deposited solder pa...

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Detalles Bibliográficos
Autores principales: Martinek, Péter, Illés, Balázs, Codreanu, Norocel, Krammer, Oliver
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9316595/
https://www.ncbi.nlm.nih.gov/pubmed/35888201
http://dx.doi.org/10.3390/ma15144734

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9316595/
https://www.ncbi.nlm.nih.gov/pubmed/35888201
http://dx.doi.org/10.3390/ma15144734

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