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Investigating Machine Learning Techniques for Predicting the Process Characteristics of Stencil Printing
Stencil printing is the most crucial process in reflow soldering for the mass assembly of electronic circuits. This paper investigates different machine learning-based methods to predict the essential process characteristics of stencil printing: the area, thickness, and volume of deposited solder pa...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9316595/ https://www.ncbi.nlm.nih.gov/pubmed/35888201 http://dx.doi.org/10.3390/ma15144734 |