Cargando…

Thermally Conductive and Electrically Insulated Silicone Rubber Composites Incorporated with Boron Nitride−Multilayer Graphene Hybrid Nanofiller

Thermally conductive and electrically insulating composites are important for the thermal management of new generation integrated and miniaturized electronic devices. A practical and eco−friendly electrostatic self−assembly method was developed to prepare boron nitride−multilayer graphene (BN−MG) hy...

Descripción completa

Detalles Bibliográficos
Autores principales: Deng, Bangjun, Shi, Yangyang, Zhang, Xiaowen, Ma, Wenshi, Liu, Hai, Gong, Chunli
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9318269/
https://www.ncbi.nlm.nih.gov/pubmed/35889561
http://dx.doi.org/10.3390/nano12142335
Descripción
Sumario:Thermally conductive and electrically insulating composites are important for the thermal management of new generation integrated and miniaturized electronic devices. A practical and eco−friendly electrostatic self−assembly method was developed to prepare boron nitride−multilayer graphene (BN−MG) hybrid nanosheets. Then, BN−MG was filled into silicone rubber (SR) to fabricate BN−MG/SR composites. Compared with MG/SR composites with the same filler loadings, BN−MG/SR composites exhibit dramatically enhanced electrical insulation properties while still maintaining excellent thermal conductivity. The BN−MG/SR with 10 wt.% filler loading shows a thermal conductivity of 0.69 W·m(−1)·K(−1), which is 475% higher than that of SR (0.12 W·m(−1)·K(−1)) and only 9.2% lower than that of MG/SR (0.76 W·m(−1)·K(−1)). More importantly, owing to the electron blocking effect of BN, the electron transport among MG sheets is greatly decreased, thus contributing to the high−volume resistivity of 4 × 10(11) Ω cm for BN−MG/SR (10 wt.%), which is fourorders higher than that of MG/SR (2 × 10(7) Ω·cm). The development of BN−MG/SR composites with synergetic properties of high thermal conductivity and satisfactory electrical insulation is supposed to be a promising candidate for practical application in the electronic packaging field.