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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the T...

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Autores principales: Lee Sanchez, William Anderson, Li, Jia-Wun, Chiu, Hsien-Tang, Cheng, Chih-Chia, Chiou, Kuo-Chan, Lee, Tzong-Ming, Chiu, Chih-Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9320615/
https://www.ncbi.nlm.nih.gov/pubmed/35890726
http://dx.doi.org/10.3390/polym14142950
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author Lee Sanchez, William Anderson
Li, Jia-Wun
Chiu, Hsien-Tang
Cheng, Chih-Chia
Chiou, Kuo-Chan
Lee, Tzong-Ming
Chiu, Chih-Wei
author_facet Lee Sanchez, William Anderson
Li, Jia-Wun
Chiu, Hsien-Tang
Cheng, Chih-Chia
Chiou, Kuo-Chan
Lee, Tzong-Ming
Chiu, Chih-Wei
author_sort Lee Sanchez, William Anderson
collection PubMed
description In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.
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spelling pubmed-93206152022-07-27 Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging Lee Sanchez, William Anderson Li, Jia-Wun Chiu, Hsien-Tang Cheng, Chih-Chia Chiou, Kuo-Chan Lee, Tzong-Ming Chiu, Chih-Wei Polymers (Basel) Article In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills. MDPI 2022-07-21 /pmc/articles/PMC9320615/ /pubmed/35890726 http://dx.doi.org/10.3390/polym14142950 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Lee Sanchez, William Anderson
Li, Jia-Wun
Chiu, Hsien-Tang
Cheng, Chih-Chia
Chiou, Kuo-Chan
Lee, Tzong-Ming
Chiu, Chih-Wei
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title_full Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title_fullStr Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title_full_unstemmed Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title_short Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
title_sort highly thermally conductive epoxy composites with aln/bn hybrid filler as underfill encapsulation material for electronic packaging
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9320615/
https://www.ncbi.nlm.nih.gov/pubmed/35890726
http://dx.doi.org/10.3390/polym14142950
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