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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the T...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9320615/ https://www.ncbi.nlm.nih.gov/pubmed/35890726 http://dx.doi.org/10.3390/polym14142950 |
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author | Lee Sanchez, William Anderson Li, Jia-Wun Chiu, Hsien-Tang Cheng, Chih-Chia Chiou, Kuo-Chan Lee, Tzong-Ming Chiu, Chih-Wei |
author_facet | Lee Sanchez, William Anderson Li, Jia-Wun Chiu, Hsien-Tang Cheng, Chih-Chia Chiou, Kuo-Chan Lee, Tzong-Ming Chiu, Chih-Wei |
author_sort | Lee Sanchez, William Anderson |
collection | PubMed |
description | In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills. |
format | Online Article Text |
id | pubmed-9320615 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-93206152022-07-27 Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging Lee Sanchez, William Anderson Li, Jia-Wun Chiu, Hsien-Tang Cheng, Chih-Chia Chiou, Kuo-Chan Lee, Tzong-Ming Chiu, Chih-Wei Polymers (Basel) Article In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills. MDPI 2022-07-21 /pmc/articles/PMC9320615/ /pubmed/35890726 http://dx.doi.org/10.3390/polym14142950 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Lee Sanchez, William Anderson Li, Jia-Wun Chiu, Hsien-Tang Cheng, Chih-Chia Chiou, Kuo-Chan Lee, Tzong-Ming Chiu, Chih-Wei Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title | Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title_full | Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title_fullStr | Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title_full_unstemmed | Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title_short | Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging |
title_sort | highly thermally conductive epoxy composites with aln/bn hybrid filler as underfill encapsulation material for electronic packaging |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9320615/ https://www.ncbi.nlm.nih.gov/pubmed/35890726 http://dx.doi.org/10.3390/polym14142950 |
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