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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the T...

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Detalles Bibliográficos
Autores principales:	Lee Sanchez, William Anderson, Li, Jia-Wun, Chiu, Hsien-Tang, Cheng, Chih-Chia, Chiou, Kuo-Chan, Lee, Tzong-Ming, Chiu, Chih-Wei
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9320615/ https://www.ncbi.nlm.nih.gov/pubmed/35890726 http://dx.doi.org/10.3390/polym14142950

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