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Failures of Cu-Cu Joints under Temperature Cycling Tests
In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO(2)) were employed to seal the joints. Stress gradients induced in the joints with the different dielectrics were simulated using a finite element me...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324419/ https://www.ncbi.nlm.nih.gov/pubmed/35888410 http://dx.doi.org/10.3390/ma15144944 |
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author | Hsu, Po-Ning Shie, Kai-Cheng Tran, Dinh-Phuc Tsou, Nien-Ti Chen, Chih |
author_facet | Hsu, Po-Ning Shie, Kai-Cheng Tran, Dinh-Phuc Tsou, Nien-Ti Chen, Chih |
author_sort | Hsu, Po-Ning |
collection | PubMed |
description | In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO(2)) were employed to seal the joints. Stress gradients induced in the joints with the different dielectrics were simulated using a finite element method (FEM) and correlated with experimental observations. We found that interfacial voids were forced to move in the direction from high stress regions to low stress ones. The locations of migrated voids varied with the dielectric structures. Under thermal cycling, such voids were likely to move forward to the regions with a small stress change. They relocated and merged with their neighboring voids to lower the interfacial energy. |
format | Online Article Text |
id | pubmed-9324419 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-93244192022-07-27 Failures of Cu-Cu Joints under Temperature Cycling Tests Hsu, Po-Ning Shie, Kai-Cheng Tran, Dinh-Phuc Tsou, Nien-Ti Chen, Chih Materials (Basel) Article In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO(2)) were employed to seal the joints. Stress gradients induced in the joints with the different dielectrics were simulated using a finite element method (FEM) and correlated with experimental observations. We found that interfacial voids were forced to move in the direction from high stress regions to low stress ones. The locations of migrated voids varied with the dielectric structures. Under thermal cycling, such voids were likely to move forward to the regions with a small stress change. They relocated and merged with their neighboring voids to lower the interfacial energy. MDPI 2022-07-15 /pmc/articles/PMC9324419/ /pubmed/35888410 http://dx.doi.org/10.3390/ma15144944 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Hsu, Po-Ning Shie, Kai-Cheng Tran, Dinh-Phuc Tsou, Nien-Ti Chen, Chih Failures of Cu-Cu Joints under Temperature Cycling Tests |
title | Failures of Cu-Cu Joints under Temperature Cycling Tests |
title_full | Failures of Cu-Cu Joints under Temperature Cycling Tests |
title_fullStr | Failures of Cu-Cu Joints under Temperature Cycling Tests |
title_full_unstemmed | Failures of Cu-Cu Joints under Temperature Cycling Tests |
title_short | Failures of Cu-Cu Joints under Temperature Cycling Tests |
title_sort | failures of cu-cu joints under temperature cycling tests |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324419/ https://www.ncbi.nlm.nih.gov/pubmed/35888410 http://dx.doi.org/10.3390/ma15144944 |
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