Failures of Cu-Cu Joints under Temperature Cycling Tests

In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO(2)) were employed to seal the joints. Stress gradients induced in the joints with the different dielectrics were simulated using a finite element me...

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Detalles Bibliográficos
Autores principales: Hsu, Po-Ning, Shie, Kai-Cheng, Tran, Dinh-Phuc, Tsou, Nien-Ti, Chen, Chih
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324419/
https://www.ncbi.nlm.nih.gov/pubmed/35888410
http://dx.doi.org/10.3390/ma15144944

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324419/
https://www.ncbi.nlm.nih.gov/pubmed/35888410
http://dx.doi.org/10.3390/ma15144944

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