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Failures of Cu-Cu Joints under Temperature Cycling Tests
In this study, the failure mechanisms of Cu-Cu joints under thermal cycling were investigated. Two structures of dielectrics (PBO/underfill/PBO and SiO(2)) were employed to seal the joints. Stress gradients induced in the joints with the different dielectrics were simulated using a finite element me...
Autores principales: | Hsu, Po-Ning, Shie, Kai-Cheng, Tran, Dinh-Phuc, Tsou, Nien-Ti, Chen, Chih |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324419/ https://www.ncbi.nlm.nih.gov/pubmed/35888410 http://dx.doi.org/10.3390/ma15144944 |
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