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Novel Approach toward the Forming Process of CFRP Reinforcement with a Hot Stamped Part by Prepreg Compression Molding
The use of carbon fiber-reinforced plastics (CFRP) is markedly increasing, particularly for the manufacturing of automotive parts, to achieve better mechanical properties and a light weight. However, it is difficult to manufacture multi-material products because of the problems due to the adhesive b...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324689/ https://www.ncbi.nlm.nih.gov/pubmed/35888214 http://dx.doi.org/10.3390/ma15144743 |
Sumario: | The use of carbon fiber-reinforced plastics (CFRP) is markedly increasing, particularly for the manufacturing of automotive parts, to achieve better mechanical properties and a light weight. However, it is difficult to manufacture multi-material products because of the problems due to the adhesive between CFRP and steel. The prepreg compression molding (PCM) of laminated CFRP can reduce the production time and increase the flexibility of the manufacturing process. In this study, a new manufacturing process is proposed for CFRP reinforcement on a hot stamped B-pillar using PCM. A finite element (FE) simulation of the hot stamping process is conducted to predict the dimensions of the B-pillar. The feasibility of PCM manufacturing is explored by the simulation of the thermoforming of a CFRP set on a shaped B-pillar. The temperature conditions of the CFRP and B-pillar for the PCM are determined by considering the heat transfer between the CFRP and steel. Finally, the PCM of the B-pillar consisting of steel and CFRP was performed to compare with the analytical results for verification. The evaluation of the B-pillar was conducted by the observation of the cross-section for the B-pillar and interlayer by scanning electron microscopy (SEM). As a result, a steel/CFRP B-pillar assembly could be efficiently manufactured using the PCM process without an additional adhesive process. |
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