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Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation

In recent years, solid-state bonding has attracted attention for various electronic packaging applications as an alternative to conventional solders. Surface-nanostructured materials enable solid-state bonding without complex surface modifications and operate at a low bonding temperature and pressur...

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Detalles Bibliográficos
Autores principales:	Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Nature Publishing Group UK 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9325727/ https://www.ncbi.nlm.nih.gov/pubmed/35882897 http://dx.doi.org/10.1038/s41598-022-17119-w

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