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Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices
[Image: see text] With the evolution of semiconducting industries, thermomechanical failure induced in a multilayered structure with a high aspect ratio during manufacturing and operation has become one of the critical reliability issues. In this work, the effect of thermomechanical stress on the fa...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9330259/ https://www.ncbi.nlm.nih.gov/pubmed/35910113 http://dx.doi.org/10.1021/acsomega.2c02122 |