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Effect of atmospheric nonthermal plasma on physicochemical, morphology and functional properties of sunn pest (Eurygaster integriceps)‐damaged wheat flour

To improve the quality of sunn pests (Eurygaster integriceps)‐damaged wheat flour, the effects of nonthermal plasma on physicochemical, rheological, functional, and microstructural properties were investigated. Gas type (air and oxygen), voltage (22 and 25 volts), and time (0, 2, 4, 6, 8, and 10 min...

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Detalles Bibliográficos
Autores principales: Tavakoli Lahijani, Amir, Shahidi, Fakhri, Habibian, Mahmoud, Koocheki, Arash, Shokrollahi Yancheshmeh, Behdad
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9361433/
https://www.ncbi.nlm.nih.gov/pubmed/35959250
http://dx.doi.org/10.1002/fsn3.2868
Descripción
Sumario:To improve the quality of sunn pests (Eurygaster integriceps)‐damaged wheat flour, the effects of nonthermal plasma on physicochemical, rheological, functional, and microstructural properties were investigated. Gas type (air and oxygen), voltage (22 and 25 volts), and time (0, 2, 4, 6, 8, and 10 min) were the variables of the experiments conducted using a completely randomized design with three replications. The results show that with increasing voltage and time of plasma treatment, the pH decreased significantly (p ≥ .05), and brightness parameter, yellow–blue parameter, water‐solubility, water absorption, oil absorption, and swelling power increased significantly (p ≥ .05). The duration of plasma treatment, voltage, and change in input gas from air to oxygen did not significantly change the gluten index, particle size, and negative electric charge of flour particles, and the amount of zeta potential of samples. Differential calorimetric analysis showed the first and second peaks of the thermogram in the range 55–99°C and also 114–99°C. Infrared spectroscopy (FT‐IR) showed hydroxyl group, CH bonds, C=O bonds, as well as the presence of types I and II amide bonds in the structure. Microstructural results indicated that plasma treatment reduced the particle size and increased particle sorting. By Increasing voltage and the duration of plasma treatment, peak viscosity, final viscosity, breakdown viscosity, pasting time and temperature significantly increased and setback viscosity decreased (p ≥ .05), which reduced retrogradation which improved the dough stability during the cooling process.