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Assembly of complex 3D structures and electronics on curved surfaces
Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance mat...
Autores principales: | , , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Association for the Advancement of Science
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9365271/ https://www.ncbi.nlm.nih.gov/pubmed/35947653 http://dx.doi.org/10.1126/sciadv.abm6922 |
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author | Xue, Zhaoguo Jin, Tianqi Xu, Shiwei Bai, Ke He, Qi Zhang, Fan Cheng, Xu Ji, Ziyao Pang, Wenbo Shen, Zhangming Song, Honglie Shuai, Yumeng Zhang, Yihui |
author_facet | Xue, Zhaoguo Jin, Tianqi Xu, Shiwei Bai, Ke He, Qi Zhang, Fan Cheng, Xu Ji, Ziyao Pang, Wenbo Shen, Zhangming Song, Honglie Shuai, Yumeng Zhang, Yihui |
author_sort | Xue, Zhaoguo |
collection | PubMed |
description | Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance materials, through controlled rolling/folding/buckling deformations. The resulting 3D structures are, however, mostly formed on planar substrates and cannot be transferred directly onto another curved substrate. Here, we introduce an ordered assembly strategy to allow transformation of 2D thin films into sophisticated 3D structures on diverse curved surfaces. The strategy leverages predefined mechanical loadings that deform curved elastomer substrates into flat/cylindrical configurations, followed by an additional uniaxial/biaxial prestretch to drive buckling-guided assembly. Release of predefined loadings results in an ordered assembly that can be accurately captured by mechanics modeling, as illustrated by dozens of complex 3D structures assembled on curved substrates. Demonstrated applications include tunable dipole antennas, flow sensors inside a tube, and integrated electronic systems capable of conformal integration with the heart. |
format | Online Article Text |
id | pubmed-9365271 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | American Association for the Advancement of Science |
record_format | MEDLINE/PubMed |
spelling | pubmed-93652712022-08-18 Assembly of complex 3D structures and electronics on curved surfaces Xue, Zhaoguo Jin, Tianqi Xu, Shiwei Bai, Ke He, Qi Zhang, Fan Cheng, Xu Ji, Ziyao Pang, Wenbo Shen, Zhangming Song, Honglie Shuai, Yumeng Zhang, Yihui Sci Adv Physical and Materials Sciences Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance materials, through controlled rolling/folding/buckling deformations. The resulting 3D structures are, however, mostly formed on planar substrates and cannot be transferred directly onto another curved substrate. Here, we introduce an ordered assembly strategy to allow transformation of 2D thin films into sophisticated 3D structures on diverse curved surfaces. The strategy leverages predefined mechanical loadings that deform curved elastomer substrates into flat/cylindrical configurations, followed by an additional uniaxial/biaxial prestretch to drive buckling-guided assembly. Release of predefined loadings results in an ordered assembly that can be accurately captured by mechanics modeling, as illustrated by dozens of complex 3D structures assembled on curved substrates. Demonstrated applications include tunable dipole antennas, flow sensors inside a tube, and integrated electronic systems capable of conformal integration with the heart. American Association for the Advancement of Science 2022-08-10 /pmc/articles/PMC9365271/ /pubmed/35947653 http://dx.doi.org/10.1126/sciadv.abm6922 Text en Copyright © 2022 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). https://creativecommons.org/licenses/by-nc/4.0/This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (https://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited. |
spellingShingle | Physical and Materials Sciences Xue, Zhaoguo Jin, Tianqi Xu, Shiwei Bai, Ke He, Qi Zhang, Fan Cheng, Xu Ji, Ziyao Pang, Wenbo Shen, Zhangming Song, Honglie Shuai, Yumeng Zhang, Yihui Assembly of complex 3D structures and electronics on curved surfaces |
title | Assembly of complex 3D structures and electronics on curved surfaces |
title_full | Assembly of complex 3D structures and electronics on curved surfaces |
title_fullStr | Assembly of complex 3D structures and electronics on curved surfaces |
title_full_unstemmed | Assembly of complex 3D structures and electronics on curved surfaces |
title_short | Assembly of complex 3D structures and electronics on curved surfaces |
title_sort | assembly of complex 3d structures and electronics on curved surfaces |
topic | Physical and Materials Sciences |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9365271/ https://www.ncbi.nlm.nih.gov/pubmed/35947653 http://dx.doi.org/10.1126/sciadv.abm6922 |
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