Development of a Reliable High-Performance WLP for a SAW Device

In this paper, we present wafer-level packaging technology for surface acoustic wave (SAW) filters with higher long-term reliability and better electrical performance. This article focuses on the package structure, fabrication processes, and reliability for the SAW filter wafer-level package (WLP)....

Descripción completa

Detalles Bibliográficos
Autores principales: Chen, Zuohuan, Yu, Daquan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9371154/
https://www.ncbi.nlm.nih.gov/pubmed/35957317
http://dx.doi.org/10.3390/s22155760

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9371154/
https://www.ncbi.nlm.nih.gov/pubmed/35957317
http://dx.doi.org/10.3390/s22155760

Ejemplares similares