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Development of a Reliable High-Performance WLP for a SAW Device
In this paper, we present wafer-level packaging technology for surface acoustic wave (SAW) filters with higher long-term reliability and better electrical performance. This article focuses on the package structure, fabrication processes, and reliability for the SAW filter wafer-level package (WLP)....
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9371154/ https://www.ncbi.nlm.nih.gov/pubmed/35957317 http://dx.doi.org/10.3390/s22155760 |