Cargando…
In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography
Synchrotron radiation dynamic imaging technology combined with the static characterization method was used to study the microstructural evolution and the growth kinetics of intermetallic compounds (IMCs) at the liquid Al/solid Cu interface. The results show that the interfacial microstructure can be...
Autores principales: | Cao, Fei, Wang, Ruosi, Zhang, Peng, Wang, Tongmin, Song, Kexing |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9414971/ https://www.ncbi.nlm.nih.gov/pubmed/36013787 http://dx.doi.org/10.3390/ma15165647 |
Ejemplares similares
-
Growth kinetics of Cu(6)Sn(5) intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
por: Zhao, N., et al.
Publicado: (2015) -
Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering
por: Kim, Dasom, et al.
Publicado: (2021) -
Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface
por: Zhao, Yangyang, et al.
Publicado: (2019) -
Steering the methanol steam reforming reactivity of intermetallic Cu–In compounds by redox activation: stability vs. formation of an intermetallic compound–oxide interface
por: Ploner, Kevin, et al.
Publicado: (2021) -
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
por: Sayyadi, Reza, et al.
Publicado: (2019)