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Thermal Hall effect in insulating quantum materials
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Elsevier
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9418594/ https://www.ncbi.nlm.nih.gov/pubmed/36039089 http://dx.doi.org/10.1016/j.xinn.2022.100290 |
| _version_ | 1784776982073966592 |
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| author | Guo, Shucheng Xu, Youming Cheng, Ran Zhou, Jianshi Chen, Xi |
| author_facet | Guo, Shucheng Xu, Youming Cheng, Ran Zhou, Jianshi Chen, Xi |
| author_sort | Guo, Shucheng |
| collection | PubMed |
| description | |
| format | Online Article Text |
| id | pubmed-9418594 |
| institution | National Center for Biotechnology Information |
| language | English |
| publishDate | 2022 |
| publisher | Elsevier |
| record_format | MEDLINE/PubMed |
| spelling | pubmed-94185942022-08-28 Thermal Hall effect in insulating quantum materials Guo, Shucheng Xu, Youming Cheng, Ran Zhou, Jianshi Chen, Xi Innovation (Camb) Editorial Elsevier 2022-07-21 /pmc/articles/PMC9418594/ /pubmed/36039089 http://dx.doi.org/10.1016/j.xinn.2022.100290 Text en © 2022 The Author(s) https://creativecommons.org/licenses/by-nc-nd/4.0/This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). |
| spellingShingle | Editorial Guo, Shucheng Xu, Youming Cheng, Ran Zhou, Jianshi Chen, Xi Thermal Hall effect in insulating quantum materials |
| title | Thermal Hall effect in insulating quantum materials |
| title_full | Thermal Hall effect in insulating quantum materials |
| title_fullStr | Thermal Hall effect in insulating quantum materials |
| title_full_unstemmed | Thermal Hall effect in insulating quantum materials |
| title_short | Thermal Hall effect in insulating quantum materials |
| title_sort | thermal hall effect in insulating quantum materials |
| topic | Editorial |
| url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9418594/ https://www.ncbi.nlm.nih.gov/pubmed/36039089 http://dx.doi.org/10.1016/j.xinn.2022.100290 |
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