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Highly Loaded and Binder-Free Molybdenum Trioxide Cathode Material Prepared Using Multi-Arc Ion Plating for Aqueous Zinc Ion Batteries

Aqueous zinc-ion batteries (ZIBS) are becoming more popular as the use of energy storage devices grows, owing to advantages such as safety and an abundant zinc supply. In this study, molybdenum powder was loaded directly on carbon fiber cloth (CFC) via multi-arc ion plating to obtain Mo@CFC, which w...

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Detalles Bibliográficos
Autores principales: Liu, Sainan, Sun, Yangyang, Yang, Jing, Zhang, Yi, Cai, Zhenyang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9457491/
https://www.ncbi.nlm.nih.gov/pubmed/36079336
http://dx.doi.org/10.3390/ma15175954
Descripción
Sumario:Aqueous zinc-ion batteries (ZIBS) are becoming more popular as the use of energy storage devices grows, owing to advantages such as safety and an abundant zinc supply. In this study, molybdenum powder was loaded directly on carbon fiber cloth (CFC) via multi-arc ion plating to obtain Mo@CFC, which was then oxidatively heated in a muffle furnace for 20 min at 600 °C to produce high mass loading α-MoO(3)@CFC (α-MoO(3) of 12–15 mg cm(−2)). The cells were assembled with α-MoO(3)@CFC as the cathode and showed an outstanding Zn(2+) storage capacity of 200.8 mAh g(−1) at 200 mA g(−1) current density. The capacity retention rate was 92.4 % after 100 cycles, along with an excellent cycling performance of 109.8 mAh g(−1) following 500 cycles at 1000 mA g(−1) current density. Subsequently, it was shown that CFC-loaded α-MoO(3) cathode material possessed significantly improved electrochemical performance when compared to a cell constructed from commercial MoO(3) using conventional slurry-based electrode methods. This work presents a novel yet simple method for preparing highly loaded and binder-free cathodic materials for aqueous ZIBs. The results suggest that the highly loaded cathode material with a high charge density may be potentially employed for future flexible device assembly and applications.