Edge-Contact MoS(2) Transistors Fabricated Using Thermal Scanning Probe Lithography

[Image: see text] The science and engineering of two-dimensional materials (2DMs), in particular, of 2D semiconductors, is advancing at a thriving pace. It is well known that these delicate few-atoms thick materials can be damaged during the processing toward their integration into final devices. Thermal scanning probe lithography (t-SPL) is a gentle alternative to the typically used electron beam lithography to fabricate these devices avoiding the use of electrons, which are well known to deteriorate the 2DMs’ properties. Here, t-SPL is used for the fabrication of MoS(2)-based field effect transistors (FETs). In particular, the use of t-SPL is demonstrated for the first time for the fabrication of edge-contact MoS(2) FETs, combining the hot-tip patterning and Ar(+) milling to etch the 2DM. To avoid contamination of the contact interface by atmospheric gas molecules, etching and metal deposition are performed without breaking the vacuum conditions in between. With this process, edge-contact MoS(2) FETs are successfully fabricated and characterized. On/off ratios up to 10(8) and 10(9) are obtained at room temperature in air and vacuum, respectively, i.e., comparable with the best values reported in the literature.