Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging

With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for nano/micro systems. The gold (Au) bump was the fr...

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Detalles Bibliográficos
Autores principales: Tian, Wenchao, Li, Zhao, Wang, Yongkun, Zhang, Guoguang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504247/
https://www.ncbi.nlm.nih.gov/pubmed/36144160
http://dx.doi.org/10.3390/mi13091537

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504247/
https://www.ncbi.nlm.nih.gov/pubmed/36144160
http://dx.doi.org/10.3390/mi13091537

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