Cargando…
Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging
With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for nano/micro systems. The gold (Au) bump was the fr...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504247/ https://www.ncbi.nlm.nih.gov/pubmed/36144160 http://dx.doi.org/10.3390/mi13091537 |