Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using Cu(2)O Nanoparticles

Plasma modification of polyimide (PI) substrates upon which electrical circuits are fabricated by the laser sintering of cuprous oxide nanoparticle pastes was investigated systematically in this study. Surface properties of the PI substrate were investigated by carrying out atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS), and contact angle measurements. Experimental results show that surface characteristics of PI substrates, including surface energy, surface roughness, and surface binding significantly affected the mechanical reliability of the sintered copper structure. Among the plasma gases tested (air, O(2), Ar-5%H(2), and N(2)-30%H(2)), O(2) plasma caused the roughest PI surface as well as the most C=O and C–OH surface binding resulting in an increased polar component of the surface energy. The combination of all those factors caused superior bending fatigue resistance.